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Why MultiLib?
MultiLibTM: Simulation and Layout Library for Multi-layered Circuit Design.

Since electronics products are becoming smaller and smaller, product designers are looking for small lateral dimensions in circuit design. Following this demand, multi-layered circuit boards based on e.g. FR4 (PCBs in general), LTCC (Low Temperature Co-fired Ceramics) or other carrier materials were and are currently under development to build circuits in the third dimension. Today, 4...8 layer substrates in FR4 and LTCC for RF circuits are quite usual. High volume applications like cellular phone handsets or the power amplifier module within, make use of these multi-layered circuit boards.

While applications are already existing, almost no simulation tools are available in the market. IMST intends to change this scenario by introducing an easy-to-use standard elements library for the simulation and layout of multi-layered RF circuits. The proposed modelling approach will be based on either static or partial dynamic 3D-EM-field simulations of the respective elements. The total design approach will be based on well-known segmentation approach subdividing the whole circuit into smaller (standard and non-standard) elements.

Commonly used elements like the existing mircostrip library (from Agilent itself) or coplanar library (CoplanTM for ADS, offered by IMST, too) will be within that library, too. This will enhance microstrip and coplanar circuit designer to achieve new levels of accuracy, as well as a wider spectrum of use for these technologies.

Due to the vast experience at IMST in multi-layered circuits design (e.g. general purpose LTCC-modules, PA-modules for GSM-phones, etc.) on substrates like LTCC, and its in-house prototyping facility, all elements of the library will be verified up to the highest applicable frequencies.

While this library consists of standard elements, the term "standard" means that a element is typically and quite often used in multi-layered circuits and has to be simulated in a quite short time, there is still some strong need for a full EM-simulation tool for the remaining high frequency problems in multi-layered circuits. Knowing this, we choose Agilent EEsof EDA's ADS tool due to the integrated presence of Momentum and Momentum RF for such kind of problems. This makes it easy-to-use for the overall circuit design.

But MultiLibTM is still flexible, it makes extensive use of the so-called data-items which make it flexible to adopt almost all multi-layered (stack-typed) substrate layers, other dielectric layers, resistive and conductive layers of modern technologies.